Patent Number: 6,670,706

Title: Semiconductor device including a semiconductor pellet having bump electrodes connected to pad electrodes of an interconnect board and method for manufacturing same

Abstract: Parts of pad electrodes formed on an interconnection board so as to correspond to bump electrodes of a semiconductor pellet that neighbor parts superposed with the bump electrodes are caused to extend in substantially the same direction, and ultrasonic vibration is applied in this extension direction so as to make a connection between the pad electrodes and the bump electrodes.

Inventors: Ikegami; Gorou (Shiga, JP)

Assignee: NEC Corporation

International Classification: H01L 21/607 (20060101); H01L 21/60 (20060101); H01L 21/02 (20060101); H01L 23/48 (20060101); H01L 23/498 (20060101); H05K 1/11 (20060101); H05K 3/32 (20060101); H01L 029/40 ()

Expiration Date: 12/30/2020