Patent Number: 6,670,889

Title: Mechanical transmission system for automatically breaking off in response to earthquake and method thereof

Abstract: A mechanical transmission system for transmitting a wafer to a semiconductor manufacturing machine and being able to break off automatically in response to an earthquake via receiving a control signal generated by an earthquake detecting device is provided. The system includes a mechanical transmission device for transmitting the wafer to the semiconductor manufacturing machine, a warning device for generating a warning signal in response to the control signal, and a control circuit electrically coupling to the mechanical transmission device and breaking off in response to the control signal for avoiding the damage of the mechanical transmission device or the semiconductor-manufacturing machine caused by the earthquake.

Inventors: Luan; Yi-Chang (Hsinchu, TW), Chiu; Tsun-Hu (Hsinchu, TW), Hsueh; Chu-Long (Hsinchu, TW)

Assignee: Winbond Electronics Corp.

International Classification: H01L 21/00 (20060101); G08B 021/00 ()

Expiration Date: 12/30/2020