Patent Number: 6,674,297

Title: Micro compliant interconnect apparatus for integrated circuit devices

Abstract: A micro compliant, test probe interconnect apparatus for an integratedcircuit device is disclosed. In an exemplary embodiment, the apparatusincludes an elongated housing and a probe pin extending from a first endof the housing. A biasing mechanism holds the probe pin in a normallyextended position, wherein the biasing mechanism is formed from a portionof the elongated housing. In a preferred embodiment, the biasing mechanismis a flexible tab, formed from a generally rectangular section of theelongated housing and bent inwardly therein to form a cantilever.

Inventors: Florence, Jr.; Robert F. (Poughkeepsie, NY), Lopergolo; Emanuele F. (Marlboro, NY), Mulligan; Vincent P. (Port Ewen, NY), Tompkins, Jr.; Charles R. (Poughkeepsie, NY)

Assignee:

International Classification: G01R 1/073 (20060101); G01R 1/067 (20060101); G01R 031/02 (); G01R 001/073 ()

Expiration Date: 01/02016