Patent Number: 6,685,796

Title: CMP uniformity

Abstract: Improved CMP uniformity is achieved by providing improved control of the slurry distribution. Improved slurry distribution is achieved by, for example, the use of a slurry dispenser that dispenses slurry from a plurality of dispensing points. Providing a squeeze bar between the slurry dispenser and wafer to redistribute the slurry also improves the slurry distribution.

Inventors: Lin; Chenting (Poughkeepsie, NY), van den Berg; Robert (Hopewell Junction, NY), Pandey; Sumit (Wappingers Falls, NY)

Assignee: Infineon Technologies AG

International Classification: B24B 57/02 (20060101); B24B 37/04 (20060101); B24B 57/00 (20060101); H01L 021/306 ()

Expiration Date: 02/03/2021