Patent Number: 6,757,961

Title: Wireless suspension salvage method

Abstract: A method to salvage suspensions from defective head gimbal assembly units is presented. Because the performance of a slider becomes more sensitive to signals and the wafer manufacturing process produces a lower yield, a suspension salvage method is developed to recycle a damaged head gimbal assembly in order to minimize material loss. In one embodiment, the salvage method includes separating a gold ball from a bonding pad of the suspension, twisting off the slider attached to the suspension, and dissolving the remaining epoxy.

Inventors: Wong; Xiao Ming (Dongguan, CN), Tao; Rock Feng (Dongguan, CN), Yang; Wei (Dongguan, CN), Peng; Di (Dongguan, CN), Yao; Ming Gao (Dongguan, CN)

Assignee: SAE Magnetics (H.K.) Ltd.

International Classification: G11B 5/48 (20060101); G11B 005/127 ()

Expiration Date: 07/02016