Patent Number: 6,761,829

Title: Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void

Abstract: A method for fabricating an electrically isolated MEMS device having an outer stationary MEMS element and an inner movable MEMS element is provided that does not use a sacrificial layer. Rather, a pair of spacers are defined on the outer portions of the upper surface of a conductive wafer, and an insulating material is deposited thereon. The spacers are attached to a substrate to define an internal void therein. The wafer is then patterned to form the outer MEMS element as well as a conductive member for the inner MEMS element, separated from the outer MEMS element by a gap. A portion of the insulating layer that is disposed in the gap is then removed, thereby releasing the inner MEMS element from the stationary MEMS element.

Inventors: Harris; Richard D. (Solon, OH), Kretschmann; Robert J. (Bay Village, OH), Knieser; Michael J. (Richmond Heights, OH), Lucak; Mark A. (Hudson, OH)

Assignee: Rockwell Automation Technologies, Inc.

International Classification: B81B 3/00 (20060101); B81C 1/00 (20060101); C23F 001/00 (); B44C 001/22 (); C03C 015/00 (); C03C 025/68 ()

Expiration Date: 07/12016