Patent Number: 6,761,905

Title: Process for the preparation of direct tabletting formulations and aids

Abstract: A thermal adhesion granulation process for preparing direct tabletting formulations or aids is disclosed. The process comprises the step of subjecting all or part of a mixture comprising: A) from about 5 to about 99% by weight of one or more diluent excipients and/or from 0 to about 99% by weight of a pharmaceutically active ingredient; B) from about 1 to about 95% by weight of a binder excipient; optionally with, C) from 0 to about 10% by weight of a disintegrant excipient; to heating at a temperature in the range of from about 30 to about C. under the condition of low moisture or low content of a pharmaceutically-acceptable organic solvent in a closed system under mixing by tumble rotation until the formation of granules.

Inventors: Yeh; Ta-Shuong (Taipei, TW), Yeh; Daniel Hungting (Taipei, TW)

Assignee: Wei Ming Pharmaceutical Mfg. Co., Ltd.

International Classification: A61K 9/16 (20060101); A61K 9/20 (20060101); A61K 009/16 (); A61K 009/20 (); A61K 009/48 ()

Expiration Date: 07/13/2021