Patent Number: 6,762,116

Title: System and method for fabricating microcomponent parts on a substrate having pre-fabricated electronic circuitry thereon

Abstract: A system and method is described for fabricating microcomponents onto pre-existing integrated electronics. One embodiment of the present invention provides additional process steps after completion of all electronics fabrication that may etch trough the oxide of any passivation layer that may be there to the single crystal silicon (SCS) of a silicon on insulator (SOI) integrated circuit. Once at the SCS level of the existing wafer, any number of microcomponents, such as connectors, receptacles, handles, tethers, and the like may preferably be fabricated onto the chip using relatively low temperature and inexpensive processing; thus, preferably preserving the integrity of the preexisting electronics.

Inventors: Skidmore; George D. (Richardson, TX)

Assignee: Zyvex Corporation

International Classification: H01L 21/02 (20060101); H01L 21/44 (20060101); H01L 021/44 ()

Expiration Date: 07/12016