Patent Number: 6,762,366

Title: Ball assignment for ball grid array package

Abstract: A printed circuit board having contacts in a contact array of rows and columns. Groups of n columns of the contacts are electrically connected to n-1 columns of vias disposed interstitially in a via array between the n columns of the contacts. A major vertical routing channel is formed between adjacent groups of n columns of the contacts and the n-1 columns of vias. First electrical traces are electrically connected to a first number of the vias. The first electrical traces are routed to an outside edge of the via array through the major vertical routing channel.

Inventors: Miller; Leah M. (Fremont, CA), Ghahghahi; Farshad (Los Gatos, CA), Fulcher; Edwin M. (Palo Alto, CA)

Assignee: LSI Logic Corporation

International Classification: H01L 23/50 (20060101); H01L 23/48 (20060101); H01L 23/498 (20060101); H05K 1/11 (20060101); H05K 001/00 ()

Expiration Date: 07/13/2021