Patent Number: 6,762,367

Title: Electronic package having high density signal wires with low resistance

Abstract: In the present invention an electronic package assembly includes an integrated circuit positioned on a substrate. The substrate has substantially horizontal layers including horizontal signal wires having vertical thicknesses and resistance. In a preferred embodiment, first and second vertical thicknesses of the signal wires alternate from the top to the bottom of the substrate such that the signal wires with greater vertical thicknesses have lower resistance than the signal wires would typically have. A plurality of substantially vertical conductive vias traverse the horizontal layers such that the vertical conductive vias connect to the integrated circuit and connect with at least one of the horizontal signal wires. A circuit board positioned beneath the substrate includes connection members for connecting with, and terminating the vertical conductive vias.

Inventors: Audet; Jean (Granby, CA), Budell; Timothy W. (Colchester, VT), Buffet; Patrick H. (Essex Junction, VT)

Assignee: International Business Machines Corporation

International Classification: H01L 23/48 (20060101); H01L 23/498 (20060101); H05K 1/02 (20060101); H01L 23/50 (20060101); H05K 1/00 (20060101); H05K 1/11 (20060101); H05K 001/03 ()

Expiration Date: 07/13/2021