Patent Number: 6,762,432

Title: Electrical field alignment vernier

Abstract: A test structure pattern includes a first comb having a first set of tines, and a second comb having a second set of tines of the same width and spacing as the first set of tines. When the test structure pattern is stepped between fields on a wafer, the first comb and the second comb at least partially overlap on photoresist over a scribe lane between the fields. When the photoresist is developed, the overlap of the first comb and the second comb generates a metal comb. Electrical continuity is checked for the metal tines of the metal comb to determine the misalignment of the fields.

Inventors: Rumsey; Robert W. (Campbell, CA)

Assignee: Micrel, Inc.

International Classification: G03F 7/20 (20060101); H01L 023/58 ()

Expiration Date: 07/13/2021