Patent Number: 6,780,898

Title: Adhesive composition

Abstract: An adhesive composition is obtained which has high reactivity and is able to connect even plastic substrates with high connection reliability. The adhesive composition is constituted of insulating resin, photopolymerization initiator, and oxetan compound.

Inventors: Kumakura; Hiroyuki (Kanuma, JP)

Assignee: Sony Chemicals Corporation

International Classification: C09J 171/02 (20060101); C08G 65/00 (20060101); C08G 65/22 (20060101); C08G 65/18 (20060101); C09J 171/00 (20060101); C09J 163/00 (20060101); C09J 161/00 (20060101); C09J 161/02 (20060101); H01L 23/48 (20060101); H01L 23/498 (20060101); H05K 3/32 (20060101); C08F 002/46 ()

Expiration Date: 08/24/2021