Patent Number: 6,794,616

Title: Solder reflow oven

Abstract: A solder flow oven comprises a reflow zone for heating a workpiece using heated air to a temperature effective to reflow solder. The reflow zone comprises a nozzle having divergent vanes that direct shear layers into neighboring zones to extend the distance over which the workpiece is heated to effective solder reflow temperature.

Inventors: Goenka; Lakhi Nandlal (Ann Arbor, MI)

Assignee: Visteon Global Technologies, Inc.

International Classification: A21B 1/00 (20060101); B23K 1/00 (20060101); B23K 1/008 (20060101); B23K 3/04 (20060101); F27B 17/00 (20060101); F27D 11/00 (20060101); H05K 3/34 (20060101); F27D 011/00 (); A21B 001/00 (); B23K 001/00 ()

Expiration Date: 09/22012