Patent Number: 6,794,620

Title: Feedforward temperature control of device under test

Abstract: In order to maintain a semiconductor device under test at a generally constant temperature, the temperature change of the device under test is characterized as the device under test undergoes changes in power level in response to an electrical testing sequence. Additionally, the temperature change of the device under test is characterized in response to changes in power level of a thermal head associated with the device under test. This information is used to select power levels of the thermal head during the electrical testing sequence so that the device under test remains at a substantially constant temperature during the electrical testing sequence.

Inventors: Touzelbaev; Maxat (Los Altos, CA)

Assignee: Advanced Micro Devices, Inc.

International Classification: G01R 31/28 (20060101); H05B 001/02 ()

Expiration Date: 09/21/2021