Patent Number: 6,794,735

Title: High permeability composite films to reduce noise in high speed interconnects

Abstract: A transmission line circuit provides a structure for improved transmission line operation on integrated circuits. The transmission line circuit includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A number of high permeability metal lines are formed on the first layer of insulating material. The number of high permeability metal lines includes composite hexaferrite films. A number of transmission lines is formed on the first layer of insulating material and between and parallel with the number of high permeability metal lines. A second layer of insulating material is formed on the transmission lines and the high permeability metal lines. The transmission line circuit includes forming a second layer of electrically conductive material on the second layer of insulating material.

Inventors: Forbes; Leonard (Corvallis, OR), Ahn; Kie Y. (Chappaqua, NY), Akram; Salman (Boise, ID)

Assignee: Micron Technology, Inc.

International Classification: G11C 7/00 (20060101); G11C 7/18 (20060101); H01L 23/52 (20060101); H01L 23/522 (20060101); H01L 029/06 ()

Expiration Date: 09/22016