Patent Number: 6,794,748

Title: Substrate-less microelectronic package

Abstract: A microelectronic die assembly including a heat dissipation device serving as a support structure for the assembly is described. A first microelectronic die is attached by a back surface to a first surface of the heat dissipation device. A first plurality of interconnects are disposed on an active surface of the first microelectronic die. A second microelectronic die is attached by a back surface to the first microelectronic die active surface. A second plurality of interconnects are disposed on an active surface of the second microelectronic die. Any appropriate number of microelectronic dice may be stacked in a like fashion.

Inventors: Chiu; Chia-Pin (Tempe, AZ)

Assignee: Intel Corporation

International Classification: H01L 21/56 (20060101); H01L 25/065 (20060101); H01L 21/02 (20060101); H01L 23/36 (20060101); H01L 23/427 (20060101); H01L 23/34 (20060101); H01L 023/34 ()

Expiration Date: 09/21/2021