Patent Number: 6,797,881

Title: Cross substrate, method of mounting semiconductor element, and semiconductor device

Abstract: A cross substrate and a method of mounting a semiconductor element are provided in which semiconductor elements can be mounted at a high density. Element side electrodes of a circuit forming surface of a semiconductor element and conductive filaments of a cross substrate are connected in a one-to-one correspondence by solder bumps. Thereafter, sealing is carried out by using a molten epoxy-based resin. In this way, a circuit forming surface side of the semiconductor element is sealed with sealing resin of the cross substrate, with the element side electrodes of the mounted semiconductor element electrically connected to conductive filaments which are wires of a cross substrate.

Inventors: Nakamura; Akio (Tokyo, JP)

Assignee: Oki Electric Industry Co., Ltd.

International Classification: H01L 23/498 (20060101); H01L 23/48 (20060101); H05K 3/10 (20060101); H05K 1/00 (20060101); H05K 005/06 ()

Expiration Date: 09/28/2012