Patent Number: 6,797,993

Title: Monolithic IC package

Abstract: A monolithic IC package, includes a monolithic IC, a package receiving the monolithic IC, an external connection terminal provided in the package and electrically connected to the monolithic IC by wiring, and protection means for protecting the monolithic IC from the electrostatic discharge, wherein the external connection terminal is used as the protection means.

Inventors: Terada; Yukihiro (Atsugi, JP)

Assignee: Mitsumi Electric Co., Ltd.

International Classification: H01L 23/28 (20060101); H01L 23/31 (20060101); H01L 23/58 (20060101); H01L 23/60 (20060101); H01L 029/72 ()

Expiration Date: 09/22016