Patent Number: 6,798,032

Title: Metal film pattern and manufacturing method thereof

Abstract: A SnO.sub.2 film having a prescribed pattern feature is formed on a substrate by a wet film-formation technology (e.g., sol-gel method). A Ni film is formed on the SnO.sub.2 film by an electroless plating method. The electroless plating method is conducted in the presence of at least one sulfur-containing compound selected from the group consisting of thiosulfates, thiocyanates and sulfur-containing organic compounds.

Inventors: Izumi; Yoshihiro (Nara, JP), Chikama; Yoshimasa (Kyoto, JP), Kawashima; Satoshi (Saitama, JP), Hashimoto; Takaharu (Saitama, JP), Yoshikawa; Itsuji (Chiba, JP), Ishikawa; Masaaki (Chiba, JP)

Assignee: Sharp Kabushiki Kaisha

International Classification: C23C 18/12 (20060101); C23C 18/16 (20060101); C23C 18/06 (20060101); C23C 18/36 (20060101); C23C 18/00 (20060101); C23C 18/31 (20060101); H01L 29/40 (20060101); H01L 29/49 (20060101); H05K 3/24 (20060101); H01L 27/12 (20060101); H01L 29/45 (20060101); G02F 1/13 (20060101); G02F 1/1362 (20060101); H01L 031/00 ()

Expiration Date: 09/28/2021