Patent Number: 6,798,059

Title: Multilayer electronic part, its manufacturing method, two-dimensionally arrayed element packaging structure, and its manufacturing method

Abstract: In order to provide a two-dimensionally arrayed probe (element packaging structure) in which a multilayer element can be used as a piezoelectric ceramic transducer element, each defective element can be replaced and the ill connection of each element can be repaired, and in order to provide a multilayer electric part suitable for realizing such an element packaging structure, the multilayer electronic part is configured with a multilayer chip-like element having a surface electrode, an internal electrode and a back electrode on the one hand and a flexible board attached to one side surface of the chip-like element on the other hand, alternate ones of the electrodes along the multilayer of the chip-like element are connected electrically to each other by the electrode pattern of the flexible board thereby to form two electrode groups, and the end portions of the electrode pattern of the flexible board are used as the two electrode portions for external connection which are electrically connected to the two electrode groups.

Inventors: Ishihara; Shosaku (Yokohama, JP), Nakamura; Masato (Yokohama, JP), Kuroki; Takashi (Yokohama, JP), Sano; Shuzou (Tokyo, JP), Izumi; Mikio (Tokyo, JP), Osawa; Takaya (Tokyo, JP), Oshiki; Mitsuhiro (Tokyo, JP)

Assignee: Hitachi, Ltd.

International Classification: B06B 1/06 (20060101); H01L 41/083 (20060101); H01L 41/00 (20060101); H01L 41/047 (20060101); H01L 023/053 ()

Expiration Date: 09/22016