Patent Number: 6,801,437

Title: Electronic organic substrate

Abstract: A method of forming electrically conductive elements on a base layer of an electronic substrate without the use of solder mask. A layer of electrically conductive material is deposited on the base layer, and a first layer of photo imageable ink is applied over the electrically conductive material layer. The first layer of photo imageable ink is patterned to expose portions of the electrically conductive material layer, which are then etched to resolve traces in the electrically conductive material layer. The first layer of photo imageable ink is removed, and a second layer of photo imageable ink is applied over the traces and channels between the traces. The second layer of photo imageable ink is then patterned to expose the traces, and a third layer of photo imageable ink is applied over the traces and the second layer of photo imageable ink. The third layer of photo imageable ink is patterned to expose deposition sites on the traces, within which are formed electrically conductive fingers. Both the second layer and the third layer of photo imageable ink are retained on the electronic substrate.

Inventors: Othieno; Maurice O. (Union City, CA), Thavarajah; Manickam (San Jose, CA), Legaspi, Jr.; Severino A. (Santa Clara, CA), Patel; Pradip D. (Redwood City, CA)

Assignee: LSI Logic Corporation

International Classification: H05K 3/28 (20060101); H05K 3/06 (20060101); H05K 3/00 (20060101); H05K 3/24 (20060101); H05K 001/18 (); H01L 021/44 ()

Expiration Date: 10/02016