Patent Number: 6,801,596

Title: Methods and apparatus for void characterization

Abstract: The present invention provides a system for characterizing voids in test samples. An x-ray emission inducer scans a target such as a via on a test sample. A metallization or thin film layer emits x-rays as a result of the scan. The x-ray emission intensity can be measured and compared against a control measurement. The information obtained can be used to characterize a void in the scan target.

Inventors: Nasser-Ghodsi; Mehran (Hamilton, MA), Testoni; Anne (Marlborough, MA), Oestreich; Steve (Mesa, AZ)

Assignee: KLA-Tencor Technologies Corporation

International Classification: G01N 23/20 (20060101); G01N 023/06 ()

Expiration Date: 10/05/2021