Patent Number: 6,803,756

Title: Wafer probe station

Abstract: The invention relates to a chuck apparatus for a wafer probe station in which the central conductive surface supports a device-under-test (DUT) over a conductive lower chuck portion. An insulator positions the center conductor surface of the chuck above the lower chuck portion and also positions an electrically isolated conductor along its periphery. A laterally extending shielding element is provided for shielding electromagnetic interference (EMI) from the center conductor surface and the lower chuck portion. The electrically isolated conductor and the conductive lower chuck portion may cooperate to form a line-of-sight electrical barrier between the center conductor surface and the laterally extending shielding element. The invention further relates to methods of manufacturing the chuck apparatus and using the apparatus to accomplish low current and voltage tests in a probe station.

Inventors: Hollman; Kenneth F. (Carson City, NV), Harrison; Daniel L. (Carson City, NV)

Assignee: The Micromanipulator Company, Inc.

International Classification: G01R 1/02 (20060101); G01R 1/18 (20060101); G01R 31/28 (20060101); G01R 031/02 ()

Expiration Date: 10/12/2021