Patent Number: 6,806,564

Title: Semiconductor apparatus with decoupling capacitor

Abstract: A lead frame type of semiconductor apparatus includes a die pad on which a semiconductor chip is mounted; ground terminals which are to be grounded; power supply terminals which are connected to a power supply; inner leads connected to the ground terminals and power supply terminals, in which a pair of adjacent inner leads for power supply terminal and ground terminal are extended inwardly; a chip capacitor mounting pad which is provided at inner ends of the extended inner leads; and a chip capacitor which is mounted on the chip capacitor mounting pad so that a decoupling capacitor is provided.

Inventors: Terui; Makoto (Tokyo, JP), Anzai; Noritaka (Tokyo, JP)

Assignee: Oki Electric Industry Co., Ltd.

International Classification: H01L 23/495 (20060101); H01L 23/58 (20060101); H01L 23/48 (20060101); H01L 23/64 (20060101); H05K 1/02 (20060101); H05K 1/18 (20060101); H01L 023/52 ()

Expiration Date: 10/19/2021