Patent Number: 6,841,587

Title: UV-curable pressure-sensitive adhesive composition and its pressure-sensitive adhesive sheet

Abstract: Provided are a UV-curable pressure-sensitive adhesive composition comprising a photoinitiator which has a molar absorptivity at 365 nm of at least 1,000 mol.sup.-1.multidot.cm.sup.-1 and the maximum absorption wavelength of at least 420 nm on a long wavelength side; and an adhesive sheet having a layer of the composition disposed over a photo-transmitting base film. The pressure-sensitive adhesive sheet according to the invention can be cured even by exposure to ultraviolet rays at a low intensity or for short time so that it can contribute to energy saving and productivity improvement as a sheet for processing, fixation or surface protection of a semiconductor wafer.

Inventors: Yamamoto; Shouji (Osaka, JP)

Assignee: Nitto Denko Corporation

International Classification: C08G 18/00 (20060101); C09J 175/14 (20060101); C09J 7/02 (20060101); C08G 18/62 (20060101); C09J 175/16 (20060101); C08G 18/81 (20060101); H01L 21/68 (20060101); H01L 21/67 (20060101); H01L 021/78 (); C09J 133/04 (); C09J 175/04 (); C08F 002/50 ()

Expiration Date: 1/11/02017