Patent Number: 6,841,651

Title: Polyamide resin

Abstract: The polyamide resin of the present invention is produced by polycondensation of a diamine component comprising 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or more of a C4-C20 .alpha., .omega.-straight-chain aliphatic dicarboxylic acid in the presence of at least one phosphorus compound selected from the group consisting of phosphinic acid compounds and phosphonous acid compounds and in the presence of an alkali metal compound of a weak acid. The weak acid has a dissociation constant lower than a first dissociation constant of a dicarboxylic acid mainly constituting the polyamide resin. The polyamide resin satisfies the following requirements (A), (B) and (C): wherein a and b are as defined in the disclosure.

Inventors: Maruo; Kazunobu (Kanagawa, JP), Kanda; Tomomichi (Kanagawa, JP), Yamamoto; Koji (Kanagawa, JP)

Assignee: Mitsubishi Gas Chemical Company, Inc.

International Classification: C08G 69/00 (20060101); C08G 69/28 (20060101); C08G 69/02 (20060101); C08G 69/04 (20060101); C08K 5/00 (20060101); C08G 69/26 (20060101); C08K 5/51 (20060101); C08G 069/08 (); B32B 027/00 (); C08L 077/00 ()

Expiration Date: 01/11/2022