Patent Number: 6,841,740

Title: Printed-wiring substrate and method for fabricating the same

Abstract: A printed-wiring substrate including a capacitor element, as well as a method for fabricating the printed-wiring substrate. An insulating substrate 3 is molded by placing a capacitor element 13 in a mold and charging a resin 4 into the mold. Therefore, the capacitor element 13 having a size (i.e., electrostatic capacitance) sufficient to suppress switching noise of an IC chip 15 and stabilize operation power voltage can be disposed, while providing a dimensional margin. Since the possibility of failing to embed the capacitor element 13 decreases, the printed-wiring substrate can be fabricated at reduced cost.

Inventors: Ogawa; Kouki (Aichi, JP), Kodera; Eiji (Aichi, JP)

Assignee: NGK Spark Plug Co., Ltd.

International Classification: H01L 21/02 (20060101); H01L 23/58 (20060101); H01L 23/64 (20060101); H01L 23/14 (20060101); H01L 23/48 (20060101); H01L 23/12 (20060101); H01L 23/498 (20060101); H01L 21/48 (20060101); H05K 1/18 (20060101); H05K 3/46 (20060101); H05K 1/02 (20060101); H05K 001/03 (); H05K 001/09 ()

Expiration Date: 1/11/02017