Patent Number: 6,841,857

Title: Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip

Abstract: An electronic component and a system carrier having a heat conduction block, on which overlapping inner flat conductor ends are fixed mechanically and insulated electrically by an organoceramic layer (6). In addition, methods of producing the system carrier and the electronic component are encompassed.

Inventors: Beer; Gottfried (Nittendorf, DE), Bergmann; Robert (Regensburg, DE), Hong; Heng Wan Jenny (Singapore, SG)

Assignee: Infineon Technologies AG

International Classification: H01L 23/495 (20060101); H01L 23/48 (20060101); H01L 23/433 (20060101); H01L 23/34 (20060101); H01L 023/495 ()

Expiration Date: 01/11/2022