Patent Number: 6,945,791

Title: Integrated circuit redistribution package

Abstract: The present invention provides a redistribution package having an upper surface that includes contacts with reduced pitch that correspond, for example, to that of a Controlled Collapse Chip Connection ("C4") structure formed on a chip, and a lower surface having contacts with increased pitch that correspond, for example, to a printed circuit board employing ball grid array ("BGA") pads. A series of power, signal and ground conductors extend through the body of the redistribution package and interconnect the circuit board contacts to the chip contacts.

Inventors: Budell; Timothy W. (Milton, VT), Tremble; Eric W. (Jericho, VT), Welch; Brian P. (Scotia, NY)

Assignee: International Business Machines Corporation

International Classification: H01R 12/00 (20060101); H01R 012/00 ()

Expiration Date: 9/20/02017