Patent Number: 6,966,440

Title: Tape-packaged headed pin contact

Abstract: A non-intrusive surface mount interconnect that provides a through-hole interconnect to the opposite side of a PCB board. A headed pin (head up/shank down) can be picked by standard placement equipment from a specially configured pocket tape using a hole that is tightly controlled for pin location. The head of the pin rests on top of the packaging tape preventing the pin from passing through the hole. A tapered section on the pin fits with minimal clearence assuring that a vacuum nozzle on the placement equipment when it descends sees and contacts the head top for vacuum nozzle pick-up.

Inventors: Kennedy; Craig M. (San Marcos, CA), Torigian; Gregory K. (Garnerville, NY)

Assignee: Autosplice Systems, Inc.

International Classification: B65D 85/20 (20060101); B65D 85/24 (20060101); B65D 085/24 ()

Expiration Date: 1/22/02018