Patent Number: 6,966,560

Title: Device for fixing thin and flexible substrates

Abstract: A device or chuck for fixing thin and/or flexible substrates allows a uniform and all-over sucking-up of the substrates without any disadvantageous warping or bending. The chuck has notches and holes communicating with a plurality of microgrooves arranged on the bearing surface. If a vacuum device sucks off air through the bores and the notches, a vacuum extends in the microgrooves so that a substrate located on the bearing surface is sucked up.

Inventors: Demel; Walter (Karlsfeld, DE), Zoberbier; Ralph (Langenbach, DE)

Assignee: Suss MicroTec Lithography GmbH

International Classification: H01L 21/67 (20060101); H01L 21/683 (20060101); B23B 031/30 ()

Expiration Date: 1/22/02018