Patent Number: 6,966,817

Title: Wafer grinder

Abstract: A wafer grinder withholds a lateral force and adjusts a tilt of worktable with precision. The wafer grinder is used to grind a wafer; that is, the tilt angle of wafer can be adjusted so that wafer is ground with precision. The wafer grinder has a housing module, a rotary worktable module, air pressure spindle module and an adjustment module.

Inventors: Tang; Kuo-Yu (Hsin Chu, TW), Huang; Jung-Hong (Ta Li, TW), Chen; Lei-Yi (Chu Tung Jen, TW)

Assignee: Industrial Technology Research Institute

International Classification: B24B 41/00 (20060101); B24B 49/16 (20060101); B24B 41/047 (20060101); B24B 7/22 (20060101); B24B 7/20 (20060101); B24B 049/00 ()

Expiration Date: 1/22/02018