Patent Number: 6,966,821

Title: Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

Inventors: Okumura; Katsuya (Yokohama, JP), Aoki; Riichirou (Tokyo, JP), Yajima; Hiromi (Kanagawa-ken, JP), Ishikawa; Seiji (Yokohama, JP), Tsujimura; Manabu (Yokohama, JP)

Assignee: Kabushiki Kaisha Toshiba

International Classification: B08B 1/04 (20060101); B24B 27/00 (20060101); B24B 55/00 (20060101); B24B 37/04 (20060101); B24B 51/00 (20060101); B24B 55/12 (20060101); F24F 3/16 (20060101); H01L 21/00 (20060101); B24B 001/00 ()

Expiration Date: 1/22/02018