Patent Number: 6,966,949

Title: Apparatus and method for drying under reduced pressure, and coating film forming apparatus

Abstract: In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.

Inventors: Kobayashi; Shinji (Kikuchi-gun, JP), Kitano; Takahiro (Kikuchi-gun, JP), Sugimoto; Shinichi (Kikuchi-gun, JP)

Assignee: Tokyo Electron Limited

International Classification: H01L 21/00 (20060101); B05D 3/04 (20060101); B05D 3/02 (20060101); B05C 011/02 ()

Expiration Date: 1/22/02018