Patent Number: 6,967,226

Title: Reactive hot-melt adhesive compositions with improved adhesion to difficult substrates

Abstract: A moisture-reactive hot-melt composition, useful as an adhesive, is provided that has improved balance of ultimate strength and adhesion to difficult substrates. In particular, the composition is made from a polyol, a polyisocyanate, and a functional polymer. Also provided are a method for making such compositions, a method for using such compositions for bonding substrates, and composite articles bonded with such compositions.

Inventors: Shah; Pankaj (Crystal Lake, IL)

Assignee: Rohm and Haas Company

International Classification: C08G 18/00 (20060101); C09J 175/04 (20060101); C08G 18/12 (20060101); C08G 18/42 (20060101); C08J 003/00 ()

Expiration Date: 1/22/02018