Patent Number: 6,967,327

Title: Contact hole standard test device, method of forming the same, method testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer

Abstract: The present invention provides a standard test device used for testing a hole of a semiconductor device. The standard test device has a structure which comprises: at least a dummy film on a base surface; at least an insulating layer which has at least one opening penetrating through the insulating layer, so that a part of a top surface of the at least dummy film is shown through the at least one opening, wherein the at least dummy film has a predetermined constant thickness at least around the at least one opening. The standard test device makes it easily possible to determine or measure a thickness of a residual film on a bottom of the contact hole.

Inventors: Yamada; Keizo (Tokyo, JP)

Assignee: Fab Solutions, Inc.

International Classification: G01N 23/225 (20060101); G01N 23/22 (20060101); G01R 017/02 ()

Expiration Date: 1/22/02018