Patent Number: 6,984,896

Title: IC chip package

Abstract: An IC chip packaging comprises a carrier having a topside, a bottom side and a passage having an opening on the topside and another opening on the bottom side, a chip mounted on the topside of the carrier and covering the opening on the topside, a plurality of bonding wires each having one end electrically connected to said chip covered on the opening on the topside and an opposite end horizontally electrically connected to the bottom side of the carrier through the opening on the bottom side, and a protective member covering the opening on the bottom side and the opposite ends of the bonding wires. The protective member has a height vertically extended from a bottom side thereof to the carrier within 0.4 mm.

Inventors: Wu; Cheng-Chiao (Taichung, TW)

Assignee:

International Classification: H01L 23/48 (20060101); H01L 29/40 (20060101); H01L 23/52 (20060101)

Expiration Date: 1/10/02018