Patent Number: 7,042,009

Title: High mobility tri-gate devices and methods of fabrication

Abstract: A high mobility semiconductor assembly. In one exemplary aspect, the high mobility semiconductor assembly includes a first substrate having a first reference orientation located at a <110> crystal plane location on the first substrate and a second substrate formed on top of the first substrate. The second substrate has a second reference orientation located at a <100> crystal plane location on the second substrate, wherein the first reference orientation is aligned with the second reference orientation. In another exemplary aspect, the second substrate has a second reference orientation located at a <110> crystal plane location on the second substrate, wherein the second substrate is formed over the first substrate with the second reference orientation being offset to the first reference orientation by about 45 degrees.

Inventors: Shaheen; Mohamad A. (Portland, OR), Doyle; Brian (Portland, OR), Dutta; Suman (Beaverton, OR), Chau; Robert S. (Beaverton, OR), Tolchinsky; Peter (Portland, OR)

Assignee: Intel Corporation

International Classification: H01L 27/01 (20060101); H01L 29/04 (20060101)

Expiration Date: 5/09/02018