Patent Number: 7,042,035

Title: Memory array with high temperature wiring

Abstract: A memory array with components that can withstand high temperature fabrication is provided. Some memory materials require high temperature process steps in order to achieve desired properties. During fabrication, a memory material is deposited on structures that may include metal lines and barrier layers. Such structures are then exposed to the high temperature processing steps and should be resistant to such temperatures.

Inventors: Rinerson; Darrell (Cupertino, CA), Longcor; Steven W. (Mountain View, CA), Hsia; Steve Kuo-Ren (San Jose, CA), Kinney; Wayne (Emmett, ID), Ward; Edmond R. (Monte Sereno, CA), Chevallier; Christophe J. (Palo Alto, CA)

Assignee: Unity Semiconductor Corporation

International Classification: H01L 31/113 (20060101); H01L 31/062 (20060101)

Expiration Date: 5/09/02018