Patent Number: 7,042,077

Title: Integrated circuit package with low modulus layer and capacitor/interposer

Abstract: A system may include a coreless substrate, a layer of material attached to the substrate, the layer of material having a lower elastic modulus than the substrate, an interposer coupled to the layer of material, and a capacitive layer coupled to the interposer.

Inventors: Walk; Michael J. (Mesa, AZ), Azimi; Hamid (Chandler, AZ), Guzek; John S. (Chandler, AZ), Gurumurthy; Charan K. (Chandler, AZ)

Assignee: Intel Corporation

International Classification: H01L 23/02 (20060101)

Expiration Date: 5/09/02018