Patent Number: 7,042,084

Title: Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core

Abstract: A semiconductor package substrate has top and bottom surface buildup layers disposed on a thermally conductive substrate core. A portion of the substrate core may be exposed at a top surface of the package substrate to allow a heat spreader to be thermally coupled to the substrate core. An integrated circuit may be mounted on a top surface of the package substrate, with a top surface of the integrated circuit facing down. A heat spreader may be attached to the package substrate. The heat spreader may be thermally coupled to the substrate core and to a backside surface of the integrated circuit.

Inventors: Takeuchi; Timothy M. (Tempe, AZ)

Assignee: Intel Corporation

International Classification: H01L 23/34 (20060101)

Expiration Date: 5/09/02018