Patent Number: 7,042,087

Title: Hybrid integrated circuit device

Abstract: The semiconductor elements for the small signal type circuits and the Au wire for connection are integrated as one package to produce the semiconductor devices 30A, 31A, 32, 33A, 34A and 38. In this way, the wire bonding of Au can be omitted, and the wire bonding of the small diameter Al wire and the large diameter Al wire is only required to complete the connection of the fine metal wire. These semiconductor devices have a plurality of circuit elements as one package, so that the mounting operation on the mounting board can be significantly reduced.

Inventors: Sakamoto; Noriaki (Gunma, JP), Kobayashi; Yoshiyuki (Gunma, JP), Maehara; Eiju (Gunma, JP), Sakai; Noriyasu (Gunma, JP), Takagishi; Hitoshi (Gunma, JP), Takahashi; Kouji (Gunma, JP), Kusano; Kazuhisa (Gunma, JP)

Assignee: Sanyo Electric Co., Ltd.

International Classification: H01L 23/52 (20060101); B23K 31/00 (20060101); H01L 23/495 (20060101)

Expiration Date: 5/09/02018