Patent Number: 7,042,091

Title: Fluorinated hard mask for micropatterning of polymers

Abstract: The present invention discloses the formation of a hard mask layer in an organic polymer layer by modifying at least locally the chemical composition of a part of said exposed organic low-k polymer. This modification starts from an exposed surface of the polymer and extends into the polymer thereby increasing the chemical resistance of the modified part of the polymer. As a result, this modified part can be used as a hard mask or an etch stop layer for plasma etching.

Inventors: Baklanov; Mikhail Rodionovich (Leuven, BE), Vanhaelemeersch; Serge (Leuven, BE), Maex; Karen (Herent, BE), Waeterloos; Joost (Leuven, BE), Declerck; Gilbert (Winksele, BE)

Assignee: IMEC vzw

International Classification: H01L 23/48 (20060101)

Expiration Date: 5/09/02018