Patent Number: 7,042,330

Title: Low resistance value resistor

Abstract: The low resistance value resistor 11 has two electrodes 12,13 of metal strips having a high electrical conductivity. The metal strips are affixed on the resistor body by means of rolling and/or thermal diffusion bonding. A fused solder layer is formed on a surface of each electrode comprised by the metal strip. Thus, sufficient bonding strength and superior current distribution in the resistor body is obtained. Further, a portion of the resistor body is trimmed by removing a portion of the body material along a direction of current flow between the electrodes to adjust a resistance value. Thus, a precise resistor value and superior characteristics of temperature coefficient of resistance (TCR) can be obtained.

Inventors: Nakamura; Keishi (Nagano, JP), Tatuguchi; Mikio (Nagano, JP)

Assignee: KOA Corporation

International Classification: H01C 1/12 (20060101)

Expiration Date: 5/09/02018