Patent Number: 7,042,729

Title: Thermal interface apparatus, systems, and fabrication methods

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.

Inventors: Dias; Rajen C. (Phoenix, AZ), Liu; Yongmei (Gilbert, AZ)

Assignee: Intel Corporation

International Classification: H05K 7/20 (20060101)

Expiration Date: 5/09/02018