Patent Number: 7,043,327

Title: Lithography apparatus and method employing non-environmental variable correction

Abstract: A lithographic apparatus for forming a patterned resist layer and a method for forming a microelectronic product both employ a lithographic exposure tool controller designed to: (1) receive input data for at least one non-environmental variable that influences an exposure dose when forming a patterned resist layer from a blanket resist layer while employing a lithographic exposure tool; and (2) determine the exposure dose for forming the patterned resist layer from the blanket resist layer while employing the input data. The apparatus and method provide for forming the microelectronic product with enhanced dimensional control.

Inventors: Tsai; Fei Gwo (Tainan, TW), Chen; Chun-Lang (Tainan County, TW), Sun; Cheng I (Taipei, TW)

Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.

International Classification: G06F 19/00 (20060101); G03F 1/00 (20060101); G03F 7/20 (20060101); G03F 7/40 (20060101)

Expiration Date: 5/09/02018