Patent Number: 7,045,206

Title: Molded panels having a soft pad armrest

Abstract: A method for forming a molded panel comprising a rigid substrate, a cover material, and a localized composite pad. The method comprises providing a molding tool having a first mold and a second mold, the first mold having a cavity; inserting a cover material between the first mold and the second mold; placing a composite pad comprising an impregnable layer and a non-impregnable layer in the cavity of the first mold, wherein the non-impregnable layer is facing the second mold and the impregnable layer is abutting the first mold; introducing resin into the molding tool; and solidifying the resin to form the molded panel whereby the non-impregnable layer of the composite pad is located adjacent the cover material.

Inventors: Granata; Giancarlo (Sterling Heights, MI), Kieltyka; Kevin Allen (Rochester, MI), Kotha; Srinivas (Vasu) (Sterling Heights, MI)

Assignee: Visteon Global Technologies, Inc.

International Classification: B32B 5/14 (20060101)

Expiration Date: 5/16/02018