Patent Number: 7,084,968

Title: Method for analyzing defect data and inspection apparatus and review system

Abstract: The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.

Inventors: Shibuya; Hisae (Yokohama, JP), Takagi; Yuji (Kamakura, JP)

Assignee: Hitachi, Ltd.

International Classification: G01N 21/88 (20060101)

Expiration Date: 8/01/02018