Patent Number: 7,086,132

Title: Method for assembling a polishing head and apparatus for detecting air leakage in the polishing head while assembling the same

Abstract: Disclosed are a method for assembling a polishing while inspecting for air leakage in the polishing head and an apparatus for performing the same. By the present invention, a polishing head may be tested for air leakage at each assembly step thereof, so that the polishing head may be assembled free of air leakage, thereby reducing testing time of the polishing head, and failure of the polishing head due to air leakage may be prevented. The apparatus includes a housing supporting the polishing head and having coupling lines coupled with ends of tubes provided in the assembled polishing head, or the polishing head being assembled. A pneumatic pressure regulating section selectively supplies positive pressure or vacuum to the tubes through the coupling lines. A sensor section detects the pressure and level of vacuum in the tubes. A determining section determines if there is air leakage in the polishing head.

Inventors: Choi; Bong (Suwon-si, KR), Sung; Jung-Hwan (Suwon-si, KR), Ro; Yong-Seok (Seoul, KR), Kim; Doeg-Jung (Suwon-si, KR)

Assignee: Samsung Electronics Co., Ltd.

International Classification: B23Q 17/00 (20060101)

Expiration Date: 8/08/02018