Patent Number: 7,086,138

Title: Method of forming a feature having a high aspect ratio

Abstract: A method for forming high aspect ratio metallization on a wafer is implemented in the formation of a disc drive recording head. The process involves patterning photoresist where metal is to be later deposited, milling around the photoresist perimeter, depositing insulating material in the milled region, around and over the photoresist, then dissolving the photoresist to be replaced with metal. The process features the ability to desirably increase the aspect ratio of height to width of a metallization on a wafer. An improved aspect ratio can be utilized to improve the quality of a write pole in a recording head, effectively increasing its achievable recording density.

Inventors: Anderson; Paul E. (Eden Prairie, MN)

Assignee: Seagate Technology LLC

International Classification: G11B 5/127 (20060101); H05K 3/10 (20060101)

Expiration Date: 8/08/02018